Outsourcing of semiconductor wafer laser trimming
We propose a layout design aimed at improving mass production efficiency and trimming accuracy.
At Rinshi Tech, we are engaged in the development and mass production of semiconductor wafer laser trimming. Please send us your test data and cut data as is. We will create a data conversion program for our equipment and perform the trimming. We will propose layout designs (such as fuse placement) aimed at improving mass production efficiency (trimming speed) and trimming accuracy. 【Features】 ■ We create a data conversion program for our equipment and perform trimming. ■ We propose layout designs aimed at improving mass production efficiency and trimming accuracy. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：菱進テック
- Price：Other
